2SK1356 DATASHEET PDF

Minimum order quantity starting at ONE piece, you can buy as many as you want. K is able to ship out same day. Paypal accepted, order online today! Thanks Allen Works to specification. Careen Everything allright - thanks you very much. Odalys nice Joelo I received today.

Author:Goltilrajas Shazilkree
Country:Nigeria
Language:English (Spanish)
Genre:Health and Food
Published (Last):28 December 2014
Pages:455
PDF File Size:8.49 Mb
ePub File Size:2.67 Mb
ISBN:614-4-57926-465-1
Downloads:82097
Price:Free* [*Free Regsitration Required]
Uploader:Miramar



TFP Series. Selection Guide. Package List. SOP Series. VS Series. Product List. Features and Structure. This structure is especially well suited to high-withstad voltage and high-current devices. Higher channel density is achieved by connecting channel vertically.

Double-Diffusion Structure. Trench Structure. All products have a protection zener diode between gate and source. Features of SOP Series. Improved trade-off between On-resistance and gate switch charge due to short-channel structure, trench contact structure and Al straps.

Improved characteristics. Qsw nC. Cgd pF. Cgs pF. Conventional Products. Output Current I out A. Ultra High-Speed. Maximum ratings. Q g typ. Part Number. SOP Advance. SOP-8 Series Line-up. Ideal use for lithium-ion battery protection and reverse current protection. Low On-resistance. Common-drain Type. Common-drain series suitable for reverse current prevention in mobile devices and lithium ion secondary battery protection.

Conventional type. Wiring resistance included since D1 and D2 are externally wired together. Maximum Ratings. DSS V. N-ch Single. P-ch Single. N-ch Dual. P-ch Dual. The VS Series that achieves the one of the industries' thinnest class package height: 0.

VS-8 Series:. PS-8 Series:. Unit: mm, typical values unless otherwise specified. VS-6 Series Line-up. VS-8 Series Line-up. PS-8 Series Line-up. Stands for Thin Flat Package. Package range for surface-mount devices. Power Dissipation P D W. Heat Dissipation Characteristic. TFP: 2SK Unit: mm. Application of DC current with infinite heat dissipation heat sink mounted.

Drain Current I D A. Measured point. Drain fin. Source fin. Source lead. Stable circuit operation. The advantage of MOSFETs is that, because of their high input impedance, they allow high output control with low power drive. However, their disadvantage is that they are susceptible to malfunction due to noise.

TFP Series devices have four pins, allowing the input drive to be kept separate from the outputs, thus reducing the risk that the outputs will affect the input. Input control signal.

L-component influence on high-current, high-speed switching. High-current, high-speed switching. Use of the S1 pin for gate input signal return stabilizes circuit operation by eliminating the influence of the L-component. Switching waveform. The four-pin structure results in a shorter rise time and more stable switching, all of which help to reduce the risk of abnormal oscillation.

When the S1 pin is not used for input signal return 3 pins :. Shorter rise time. When the S1 pin is used for input signal return 4 pins :. This contributes to equipment's size reduction thinner size. New Products. Power dissipation efficiency improvement. Conventional Product.

V DSS V. Learn more about Scribd Membership Home. Much more than documents. Discover everything Scribd has to offer, including books and audiobooks from major publishers.

Start Free Trial Cancel anytime. Uploaded by Wirawan Satria. Document Information click to expand document information Date uploaded Dec 16, Did you find this document useful? Is this content inappropriate? Report this Document. Flag for Inappropriate Content. Download Now. Related titles. Carousel Previous Carousel Next.

Jump to Page. Search inside document. SOP Series products are compact and thin, and require only a small. They are suitable for lithium-ion secondary battery.

TFP Series devices have the same ratings as existing. TOSM package devices; however, the volume of them occupies. High-integration is achieved using trench structure technique. This Series is comprised of highly integrated, high-performance,.

This series downsized 2. In addition, the chip design. With employing submicron technology and reducing gate charge,.

74LS123 DATASHEET PDF

Sitemap Index

.

ARJO MALIBU BATH PDF

供应长年拆机电子元件【电子元器件】

.

Related Articles